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The SMT patch processing is simple and complicated. Generally, after SMT is adopted, the volume of electronic products is reduced by 40%-60%, and the weight is reduced by 60%-80%. The volume and weight of the integrated circuit after processing are only about 1/10 of the traditional plug-in components, with high reliability and strong anti-vibration ability. More and more advanced SMT chip processing technology has made the electronics industry prosperous.

SMT patch production equipment mainly includes solder paste printers, placement machines, reflow ovens, and perspective testing equipment.

1. Determine whether to process the template according to the designed PCB. If the SMD components on the PCB are only resistors, capacitors, and the package is 1206 or more, you don’t need to make a template, and use a syringe or automatic dispensing equipment for solder paste coating; when the PCB contains SOT, SOP, PQFP, PLCC and BGA packaged chips, resistors, and capacitors must be made into templates for packages below 0805.

2. Use a squeegee to print the solder paste or patch glue onto the pads of the PCB to prepare for the placement of components, also known as silk screen printing. The equipment used is a solder paste printer, a screen printer, etc.

3. Mounting refers to accurately mounting surface mount components on a fixed position on the PCB. The equipment used is Pick-and-place machine (automatic, semi-automatic or manual), vacuum suction pen or tweezers, etc.

4. Melt the solder paste so that the surface mount components and PCB are firmly brazed together, commonly known as reflow soldering. The equipment used is a reflow oven (automatic infrared/hot air reflow oven).

5. Remove the substances that affect the electrical performance or solder residues such as flux on the mounted PCB, commonly known as cleaning. The equipment used is recommended by UFJ Pneumatic Steel Mesh Cleaning Machine.

6. The soldering quality and assembly quality of the mounted PCB are inspected. The equipment used is recommended by UFJ X-ray inspection equipment, real-time imaging, online or offline can be selected according to needs.

7. Rework the faulty PCB, the tools used are smart soldering iron, rework workstation, etc.

The printed circuit board (PCB) manufacturing process requires a complex procedure to ensure the performance of the finished product. Though circuit boards can be single, double or multilayered, the fabrication processes used only differ after the first layer's production. Due to differences in the structure of the PCBs, some may require 20 or more steps during manufacturing.Here we use a Youtube video from Strange Parts to introduce the PCB manufacturing process in detail.


There are four main parts to a PCB:

1.Substrate: The first, and most important, is the substrate, usually made of fiberglass. Fiberglass is used because it provides a core strength to the PCB and helps resist breakage. Think of the substrate as the PCB's “skeleton”.


2.Copper Layer: Depending on the board type, this layer can either be copper foil or a full-on copper coating. Regardless of which approach is used, the point of the copper is still the same — to carry electrical signals to and from the PCB, much like your nervous system carries signals between your brain and your muscles.


3.Solder Mask: The third piece of the PCB is the solder mask, which is a layer of polymer that helps protect the copper so that it doesn’t short-circuit from coming into contact with the environment. In this way, the solder mask acts as the PCB's “skin”.


4.Silkscreen: The final part of the circuit board is the silkscreen. The silkscreen is usually on the component side of the board used to show part numbers, logos, symbols switch settings, component reference and test points. The silkscreen can also be known as legend or nomenclature.


The steps of the PCB design process start with design and verification and continue through the fabrication of the circuit boards. Many steps require computer guidance and machine-driven tools to ensure accuracy and prevent short circuits or incomplete circuits. The completed boards must undergo strict testing before they are packaged and delivered to customers.


Step One: Designing the PCB

Step Two: Design Review and Engineering Questions

Step Three: Printing the PCB Design

Step Four: Printing the Copper for the Interior Layers

Step Five: Etch the Inner Layers or Core to Remove Copper

Step Six: Layer Alignment

Step Seven: Automated Optical Inspection

Step Eight: Laminating the PCB Layers

Steps Nine: Drilling

Steps Ten: PCB Plating

Step Eleven: Outer Layer Imaging

Step Twelve: Outer Layer Etching

Steps Thirteen: Outer Layer AOI

Steps Fourteen: Solder Mask Application

Step Fifteen: Silkscreen Application

Step Sixteen: Finishing the PCB

Step Seventeen: Electrical Reliability Test

Step Eighteen: Profiling and Route Out

Step Nineteen: Quality Check and Visual Inspection

Step Twenty: Packaging and Delivery

If you need know more details steps,please download here

If you need know PCB machines how to work,please download here




Contact: Jacktao

Phone: +86-13815034152

E-mail: director@yunismart.com


Add: No.143,Qingyangbei Road,Changzhou,Jiangsu,China